SMC Plating Process

Column：Applications Time：2018-01-31

SMC Plating Process

ATOMI has a team of professionals specializing in development of plating solutions for electronic surface mount devices. We develop our own process based on the imported technology from Europe, Japan and the US. Our products are also developed according to requirement of various devices and support provided from the respective equipment. Our pure Tin plating process was developed under the idea of fulfilling Lead free requirement of the European and Japanese Market. It can generate deposit with dense and fine crystals, strong anti-aging , good solderability and compatible with RoHS standard.

ATOMI Product / Process Flow

Pre-treatmeat

ATPREP SL-SMC
ATPREP SH-SMC

↓

Activating

ATPREP A-SMC

↓

Nickel Plating

ATNIC ELS
ATNIC EHT

↓

Pre-dipping

↓

Pure-Tin Plating

ATSOLDER SMC Serie includes:
ATSOLDER SMC-370
(pH: 3.0~4.5)
ATSOLDER SMC-371
ATSOLDER SMC-380
(pH: 2.0~3.0)
ATSOLDER SMC-381

Product	Features / Benefits
ATNIC ELS	Sulfamate plating system with special additive, decrease internal stress of deposit to minimum. Semi-bright deposit, high density crystals, can achieve even thickness in a wide range of current densities. High cathode efficiency, shortens plating time. Special Fluoride free anode activator, greatly increases dissolution of Nickel anode and lower consumption of Nickel Sulfamate

ATNIC EHT

Specially formulated to solve problem of Tin tarnishing during IR-Reflow at 260 ℃

High plating efficiency, low internal stress of deposit

ATSOLDER
SMC Series

Solution properties
MSA base pure Tin plating system
Single additive, easy to maintain
Ability to operate at high temperature, the solution can operate at a maximum temperature of 40 ℃
High cathode efficiency
No small molecule organic compounds
Deposit properties
Good solderability
Good resistance to aging (high temperature aging, steam aging)
Dense deposit crystals, uniform crystal size
Uniform deposit thickness, low thickness deviation between high and low current density area

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Next： ATFIN Protection Process

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ATFIN Protection Series

Aluminium Wheel Plating Process

Microwave Base Station Plating Process

Plating on Plastics Process

Reel to Reel Plating Process

SMC Plating Process

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Room 713, Tian Hui Building, HuaXing Road,
Dawei Industrial Park, Long Cheng District,
Longgang, Shenzhen,P.R. China
Post Code: 518172
Tel: +86 755 89724698
Fax: +86 755 8972 4616
E-mail：enquiry@atomi.com.cn

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