ATFIN Protection Process

Column：Applications Time：2018-01-31

ATFIN Protection Process

ATFIN Protection Process
ATFIN AG S	Mainly applys to barrel plated parts Water soluble, solvent free No effect on electrical resistance and solderability of Silver

ATFIN AG S PLUS	Mainly applys to communication base station to provide extra corrosion resistance on silver deposit Water soluble, solvent free No effect on electrical resistance and solderability of Silver

ATFIN AG S R/R	Specialy for mulated applys to reel to reel plating on connectors Water soluble, solvent free No effect on electrical resistance and solderability of Silver

ATFIN WS	Specialy for mulated applys to reel to reel plating on connectors Water soluble, solvent free No effect on electrical resistance and solderability of Silver


ATFIN CU S	Water soluble, safe and environmental friendly Formation of a transparent film on Copper and Copper alloys No effect on electrical resistance and solderability of Copper


ATFIN AU S	Water soluble, solvent free Formation of a transparent film on top of the Gold. Greatly improves anti tarnishing ability, corrosion resistance and wear resistance of Gold deposit


ATFIN NI S	Water soluble, solvent free Formation of a transparent film on top of Nickel deposit. Greatly improves anti tarnishing ability, corrosion resistance of Nickel. No effect on solderability of Nickel deposit Since the film is low in water affinity, it can help to remove water marks on surface of deposit.


ATFIN SN S	Water soluble, solvent free, Formation of a transparent film on top of Tin deposit. Greatly improves anti tarnishing ability, corrosion resistance of Tin. No effect on solderability of Tin deposit

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