ATALUM Plating on Aluminum process

Component

Conc. (mL/L)

ATALUM®

DW-110

Non-phosphorus & non-silicon, alkaline degreaser.

DW-110

20-100

-----

82-93

3-7

ATALUM®

DW-120

Special formulation process for degreasing.

DW-120

Hot immersion:

50-150

-----

60-90

4-10

Ultrasonic:  10-30

ATALUM®

 S-210

Phosphate-free, alkaline soak cleaner is used in  dispersing, emulsifying

and saponifying mineral  and organic soils.

S-210

55-70g/L

-----

55-65

3-5

ATALUM®

 S-211

Non-phosphate soak cleaner.

S-211

55-70g/L

-----

60-70

1-5

ATALUM®

 S-212

Alkaline free & silicate free, soak etcher.

S-212

30-40g/L

-----

20-35

0.25-0.5

ATALUM®

 S-213

Specially developed for cleaning aluminum memory disk,

and effectively emulsifying mineral soils on the surface of the aluminum memory disk

S-213

55-70g/L

-----

55-65

3-5

ATALUM®

AE-310

ATALUM® AE-310 is an acid liquid etch specially formulated for use in the pre-treatment

 cycles for Al-wheel plating.ATALUM® AE-310 is also preferred for high-finish aluminium

 surface because it does not change the appearance of polished aluminum.

AE-310

160-200

-----

RT

2-6

ATALUM® 

BE-320

ATALUM® BE-320 is an alkaline power etch used in pre-treatment cycles for Al-wheel plating,

but not produce Al(OH)3on the surface of plated parts.

BE-320

30-60 g/L

-----

RT

0.3-1

ATALUM®

 DS-410

ATALUM® BE-320 is a crystalline, acidic,  fluoride-containing compound used for etching aluminum alloys. ATALUM® BE-320 can also be used as a replacement hydrofluoric acid,

but less hazardous to handle than liquid hydrofluoric acid.

DS-410

30-120 g/L

-----

RT-66

---

ATALUM®

DS-420

Acid liquid can rapidly remove the smutty from aluminum alloys.

 Nitric acid- Phosphoric acid based formulation ensures the subsequent adhesion.

DS-420

250-350

-----

RT

0.5-1.5

ATALUM®

Zincate EZ

Zincate process is especially designed to produce a fine grained zinc deposit

 on the surface of aluminum alloys.

EZ-A

500-600

-----

20-30

30-120

EZ-B

Add based on analysis

EZ-C

Add based on analysis

ATALUM®

ZC-12

Cyanide-free, zincate process produces a very fine-grained, uniform layer,

 especially suitable for electronics applications of aluminum alloy.

 ZC-12

35-45%(v/v)

-----

20-30

0.5-0.8

(the first time)

0.3-0.6

（the second time）

ATALUM®

ZC-18

Cyanide-free zincate process. Use in electronic alloy component,

wireless communication equipment and hard disc.

ZC-18

35-45%(v/v)

20-30

0.5 -0.8 (the first time)

0.3-0.6 (the second time)

ATALUM®

ZC-24

Cyanide-free zincate process. Create mild etching to aluminum substrates

ZC-24

20-40%(v/v)

20-30

0.5-0.8 (the first time)

0.3-0.6 (the second time)

ATALUM®

NIS-510

Nickel strike solutionproduces a high throwing high ductile and low stress active nickel layer, 

especially designed for Al-Wheel plating.

NIS-510 A

40-60

2-10

50-65

15-30

NIS-510 GR

0.4-0.6

W-18

1-2

ATALUM®

HL

The process is especially designed for Al-Wheel plating.

Provides an initial semi-bright deposit when duplex nickel plating.

Deposits are virtually sulfur-free, well leveled, and very ductile.

HL   B

9-12

3-9

52-63

As required.

HL   L

0.3-1.0

HL  H

0.1-0.25

W-19

2.0-5.0

ATALUM®

ATL

Non-sulphur, semi-bright

nickel plating process,

especially designed for Al-Wheel plating.

ATL   M

3-6

4.3-6.5

50-70

As required.

ATL   L

0.25-1.0

ATL   T

Add as required

W-19

1-3

ATALUM®

HS

Produces a high-activity nickel strike layer between sulfur-free semi-bright

and bright nickel layers.

HS

3.5-7.5

2.1-4.3

46-52

As required.

W-18

1-5

ATALUM®

BN-68 

The process is especially designed for Al-Wheel plating.

Features outstanding ductility and superior

leveling and brightness, even in CD. area.

 BN-68

0.3-0.8

2-10

50-65

As required.

 C-130

4-8

W-18

0.5-1.0

ATALUM®

Nickel Seal 98

Nickel seal process improve corrosion protection of the deposit,

especially designed for Al-Wheel plating.

Ni  Seal  98

As required

2-5

45-65

As required

Carrier

As required

D

0.6-2.0

L

2-5 g/L

S

0.2-2.0 g/L

ATALUM®

 CUM-99

High brightness acid copper process is ideally suited where exceptional throwing power and coverness,

high leveling properties are required,  specially designed for base station plating.

 CUM-99

 8-16

Anode

1-2

28-32

As required