ATCOP Copper Plating Process
ATCOP Copper Plating Process
Product | Features | Solution | CD(A/dm2) | Temp.(℃) | |
Component | Conc.(mL/L) | ||||
ATCOP®Cu-66 | Bright Cyanide Copper plating process. Usually as undercoat for copper & nickel plating. Applicable on iron, copper & ZBDC substrate. | Cu-66 AA | 30-50 | 0.5-4 | 50-60 |
Cu-66 A | 5-8 | ||||
Cu-66 B | 5-6 | ||||
ATCOP®Cu-88 | Bright acid copper plating process. Good leveling power, low internal stress, good ductility and excellent brightness. Suitable for plating on iron-steel alloys, copper, zinc alloy, aluminum alloys and plastic parts. | Cu-88 Mu | 4-12 | 1-6 | 18-35 |
Cu-88 A | 0.4-0.6 | ||||
Cu-88 B | 0.1-0.4 | ||||
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Aluminium Wheel Plating Process
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