ATNIC Nickel Plating Pr-ocess

Component

Conc.(mL/L)

ATNIC®

PEARLBRITE

No.6

Pearl Nickel plating process which can produce uniform, smooth, fine grained deposit.

Applicable to iron and copper substrate. Suitable for rack plating

No.6 A

0.3-0.5

3-8

50-55

No. 6 G

15-25

No. 6 H

4-10

ATNIC®

SEMIBRITE

Ni MTL

Semi-bright Nickel plating process with good leveling and ductility.

Specially suitable for multi-layer nickel plating

MTL M

9-12

3-9

52-63

MTL T

0.1-0.25

MTL L

0.3-1.0

W-19

2.0-5.0

ATNIC® SUPER B-52

Bright nickel processes for rack plating, which produces ductile,

good brightness and good throwing deposit.

Suitable for chromium plating afterwards.

B-52

0.3-0.5

2-8

50-65

C-130

3-5

W-19

0.5-1.0

ATNIC® SUPER E-6

Bright nickel process which produces ductile deposits with high brightness and good leveling.

Good for Chromium plating afterwards

E-6

1.5-2.5

Cathode

2.2-11.0

57-68

E-4

7.5-10

Nisof

7.5-10

Anode

1.1-3.3

W-19

1.0-2.0

ATNIC® SUPER E-8

Bright Nickel plating process for rack plating.

 It produces whitish deposit with good ductility,

good leveling and good throwing.

E-8

0.3-0.8

2-10

50-65

C-130

3-5

W-18

0.5-1.0

ATNIC®

BARRELBRITE Ni-117

High speed, bright nickel plating process for barrel plating.

Applicable to iron, Steel, copper, Brass and ZBDC substrate.

Ni-117 A

0.3-0.5

0.2-1.0

50-65

C-130

6-10

W-18

0.8-1.2

ATNIC®

High Sulfur

Ni HS

Nickel strike process of high sulphur content.

Ni  HS

3.5-7.5

2.1-4.3

46-52

W-18

1-5

ATNIC®

NICKEL SEAL 90

Nickel seal plating process for final coating of multi-layer nickel plating.

It enables formation of Micro-cracking chromium layer from the chromium plating afterward,

and improves overall corrosive resistance.

Additive

As required

2 - 5

45-65

Carrier

As required

Dispesing

Agent D

0.6-2.0

Particle L

2-5 g/L

Particle S

0.2-2.0 g/L

ATNIC® Low Stress Nickel ELS

Sulphamate type nickel plating process with deposits of low internal stress and good ductility.

Widely applies to PWB, semi-conductors, connectors and other electronic components.

A.A

48-85

1.6-8.6

51-57

ELS R

6-18

W.A

1-5

ATNIC® High Speed

& Low Stress Nickel EHS

High speed, Sulphamate type nickel plating process with deposits of low internal stress and good ductility. Widely applies to PWB, semi-conductors, connectors and other electronic components.

A.A

80-90

8-25

51-57

EHS R

35-45

WA

1-5

ATNIC® High Ductility Nickel EGD

Sulphamate type nickel plating process with deposits of low internal stress and good ductility.

Widely applies to electronic components,

 also applicable as a basecoat for precious metals and general metal plating.

A.A.

Rack plating

48-85

Rack plating

1.6-8.6

51-57

High speed plating

80-90

EGD R

Rack plating

12-18

High speed plating

8-25

High Speed plating

35-45

WA

1-5

ATNIC® High Temperature Nickel EHT

Sulfphamate type ncikel plating process which produces deposits with

 good deposits with good ductility and can tolerate high temperatures.

 Suitable as the undercoat for tin plating.

A.A

50-100

5-35

50-60

EHT A

20-40

EHT R

15-25

W.A

0.5-2.0

ATNIC® Electroless Nickel EN-616

Alkaline, electroless nickel strike plating process. It produces thin,

uniform and active deposits. Suitable for pre-treatment of electroless nickel plating on aluminum.

EN-616 A

160-180

35-43

EN-616 B

For replenishment

EN-616 C

60-80

ATNIC® Low-P Electroless Nickel EN-818

Low phosphorus (2-4 %), low temperature, high speed electroless nickel process.

 It produces deposits with high hardness, good abrasive resistance and uniform brightness.

EN-818 A

60

76-94

EN-818 B

150

EN-818 C

For replenishment

ATNIC® Mid-P Electroless Nickel EN-828

Medium phosphorus (7-8%), high speed, bright electroless nickel process.

It generates deposits with high hardness, and good wear resistance. Plating speed = 15-20 μ/hr

EN-828 A

60

82-88

EN-828 B

90

EN-828 C

For replenishment

ATNIC®Mid-P Electroless Nickel EN-828 G

Lead-free and cadmium free mid-phosphorus electroless nickel process

EN-828G A 

50-70

82-88

EN-828G B

135-165

EN-828G  C

For replenishment

ATNIC® Mid-P Electroless Nickel EN-829

Low to medium phosphorus (5-7%), high speed, and bright electroless nickel process.

It generates deposits with high hardness, good wear and resistance. Plating speed = 17-20 μ/hr

EN-829  A

60

82-91

EN-829  B

150

EN-829  C

For replenishment

ATNIC® High-P Electroless Nickel EN-838

High phosphorus (10.5-12%), bright electroless nickel process.

It generates deposits with excellent corrosion resistance.

Widely applies to engineering and functional application. Plating speed = 10-14 μ/hr

EN-838  A

60

82-88`

EN-838  B

180

EN-838  C

For replenishment

ATNIC® High-P Electroless Nickel EN-838 G

Lead free and cadmium free high phosphorus electroless nickel process

EN-838 G A

60

EN-838 G B

150

82-88`

EN-838 G C

For replenishment