ATNIC EHT: |
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1. High plating efficiency, suitable for electronic high speed plating
2. Low internal stress, excellent covering power, suitable for bended plating parts.
3. Good resistance to tarnish, reduces tarnishing effect on Tin layer.
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ATSOLDER SN-767: |
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1. MSA base high speed matt Tin plating process, high deposition speed, high plating efficiency
2. Single component make up, two components additive, room temperature operation, easy to maintain.
3. Good resistance to aging of deposit, good solderability
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ATSOLDER SN-757: |
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1. MSA base high speed matt Tin plating process, high deposition speed, high plating efficiency
2. Single component make up, two components additive, room temperature operation, easy to maintain.
3. Good resistance to aging of deposit, good solderability
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ATFIN AU S & AG S :
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Water soluble anti-tarnisher for Gold &
Silver,environmental friendly. Easy to maintain, effectively improve
resistance of Goldl & Silver deposit against various test such as
salt spray, aging, sulphur testing.
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