ATPAD Palladium Plating Process
ATPAD Palladium Plating Process
Product | Features | Solution | CD (A/dm2) | pH | Temp(℃) | ||
Component | Conc. (g/L) | ||||||
ATPAD® DPC 28 | Palladium-Cobalt plating process. Since it is a nickel free process, it will not cause the nickel allergy symptoms. The process generates white and bright deposits with high hardness and good wear resistance. The deposits can be a barrier layer to prevent metal migration or as a top coat in decorative plating industries. | Pd | 3.5-4.5 | Rack | 0.5-1.5 | 8.3-8.8 | 33-40 |
Co | 0.35-0.6 | ||||||
B1 | 80%( v/v) | Barrel | 0.3-0.7 | ||||
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