ATSIL Silver Plating Process
Product | Features | Solution | CD (A/dm2) | pH | Temp (℃) | |
Component | Conc. (mL/L) | |||||
ATSIL® AG 3 | Cyanide base bright silver plating The solution can generate mirror bright silver deposits of any thickness. Applicable to a wide variety of functional and decorative industries. | Ag | 20-40 g/L | 0.5-4.0 | 12.0-12.5 | 20-40 |
Ag 3 A | 20 | |||||
Ag 3 B | 10 | |||||
ATSIL® AG 5 | Cyanide base bright silver plating process for barrel application. Mirror bright silver deposits of any thickness can be generated by this process. Applicable to both functional and decorative industries. | Ag | 10-20 g/L | 0.1-1.0 | 12.0-12.5 | 18-30 |
Ag 5 A | 20 | |||||
Ag 5 B | 10 | |||||
ATSIL® AG 8 | Bright silver plating solution specially formulated for communication base station made with aluminum alloy. Mirror bright deposits of any thickness can be generated from this process. | Ag | 10-20 g/L | 0.05-1.0 | 12.0-12.5 | 18-30 |
Ag 8 A | 20 | |||||
Ag 8 B | 10 | |||||
ATSIL® HS-2 | Non-cyanide high speed silver plating process. The plating solution does not contain free cyanide, and can stand very high current densities. | Ag | 50-70 g/L | 30-80 | 7.5-7.8 | 50-70 |
HS-2 B | 0.5L/L | |||||
ATSIL® HS-5 | High speed silver plating solution. The plating solution consists of free cyanide. A stable plating process and can stand very high current densities. | Ag | 50-70 | 30-150 | 8.0-9.5 | 50-70 |
Make Up: B | 0.5L/L | |||||
R | 5-100 | |||||
WA | 5 |