ATGOLD Gold Plating Process

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ATGOLD Gold Plating Process

A complete sereis of gold plating processes to meet the requirements of various industries, from good abrasive resistance, bondability for electronic components to vibrantly coloured, elegant looking requirements for decorative applications.

Product

Features

Solution

CD

(A/dm2)

pH

Temp

()

Component

Conc.(g/L)

ATGOLD®

ECC

Acid gold plating process with cobalt as a co-deposit. Deposits exhibit good wear resistance with hardness 190HV. Specially formulated for connectors & PWB finger plating.

Au

6-10

Rack plating:0.3-2.5

4.7-5.2

30-40

Co

1.3-1.8

ECC  B

60% (V/V)

Barrel plating:0.2-0.5

ATGOLD®

EHD

High speed, acidic hard gold plating with cobalt as a co-deposit. Deposits exhibit high hardness and wear resistance. Suitable for automatic plating line.

Au

4-16

≤100

4.2-4.6

50-70

Co

0.7-1.0

EHD  B

60% (V/V)

ATGOLD®

EGS 1

Neutral gold plating process. Deposits exhibit purity of up to 99.99% with good bond ability. Specially formulated for semi-conductor plating.

Au

8

0.3-1.5

7.0-7.5

45-65

EGS1   B

60% (V/V)

ATGOLD®

EGS 2

Neutral gold plating process. Deposits exhibit purity of up to 99.99% with good bond ability. Solution can stand for high current density high deposition speed. Specially formulated for high speed selective plating.

Au

12-20

2.0-10.0

6.0-8.0

70-75

EGS 2

60% (V/V)

ATGOLD®

DGF 2

Neutral gold plating process which produces deposits with 24K purity. Deposits also show rich gold color. Specially formulated for low cost jewelry and the decorative industry.

Au

0.8-2.5

Rack plating:  0.5-1.2

 3.5-4.0

 40-60

 DGF2  B

, 60% (V/V)

Barrel plating:0.2-0.5

ATGOLD®

DGK

A series of gold plating process. Color of deposits match with NIHS standard. Applicable as the final coating of decorative gold plating. User friendly and stable solution. Various thicknesses of gold can be achieved. Suitable for both rack and barrel plating.

Au

4

Rack plating0.5-1.5

3.2-3.8

30-40

DGK   B

60% (V/V)

Barrel plating0.2-0.4

ATGOLD®

AUFORM 24

High purity gold electroforming process. Stale solution with good throwing power and high deposition speed. Deposit shows yellowish gold in color with good ductility. Stable color and carat value. Thickness of deposit can build up to 100 times that of ordinary gold plating.

Au

8

0.3-1.5

7-7.5

45-65

AUFORM 24  B

60% (V/V)