ATSOLDER Tin Plating Process

Component

Conc. (mL/L)

ATSOLDER®

Sn-737

Sulfate bright tin-plating process

Sn-737 A

3-4% (v/v)

Pack

0.5-4

16-27

Sn-737 B

0.5-0.75% (v/v)

Barrel

0.5-3

ATSOLDER®

Sn-757

High speed, matt Tin plating process. Widely applies  electronic plating.

Sn-757A

20-80

5.5-32

20-45

ATSOLDER®

Sn-767

High speed, bright Tin plating process. Widely applies  electronic plating.

Sn-767 A

60-100

5.5-32

14-35

AO

8-12

ATSOLDER®

Sn-777

Matt Tin plating process, widely applies in rack & barrel plating of electronic components.

Sn-777 A

20-80

0.5-5.0

20-45

 ATSOLDER®

Sn-787

Bright Tin plating process, widely applies in rack & barrel plating of electronic components.

Sn-787 A

20-80

0.5-5.0

14-35

AO

1-5

ATSOLDER®

SMC-370

Methyl base, high pH value, Tin plating solution.

Specially formulated for plating of electronic ceramic clip devices.

SMC conducting solution

100-150

0.2-1.0

22-40

SMC

adjustment

50-100g/L

SMC-370 A

25-80

ATSOLDER®

SMC-380

Methyl sulfonate base Tin plating solution.

Specially formulated for plating of electronic clip devices.

It produces deposits with good distribution and retards oxidation.

SMC conducting solution

120-180

0.2-1.0

18-40

SMC adjustment

50-100g/L

SMC-380 A

25-80

ATSOLDER®F

Flocculate Sn4+ in the plating solution

A

0.5-5

RT

B

1-10

ATSOLDER®

SL

Silicon free defoamer which effectively removes foam from any plating solution

10-30